- Industry: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
An MOS technology in which both P-channel and N-channel devices are fabricated on the same die.
Industry:Semiconductors
The measurement (in /°C or ppm/°C) of the rate at which a given material will expand or contract as the temperature changes. Where two materials with different rates of thermal expansion are joined, expansion or contraction will strain the bond interface between them. Continual straining of that bond could result in separation.
Industry:Semiconductors
A hybrid having an inner seal perimeter (that is, cavity perimeter) of greater than 2 inches (as defined in MIL-STD-883, Method 5008).
Industry:Semiconductors
In hybrids, the monometallic bonding of one band on top of another.
Industry:Semiconductors
A requirement that a vendor notify the procuring and/or qualifying activity of a change in product manufacture or test. In some cases, the requirement will include delay of change implementation until after formal approval of the change.
Industry:Semiconductors
The drop from the surface of the passivation to the surface of the contact itself.
Industry:Semiconductors
The opening in the surface passivation through which the device metallization makes contact with the circuit elements.
Industry:Semiconductors
The subjection of devices to a G force (typically 30,000 G's) in a centrifuge for a short duration in order to test die-attach, lead bond and package integrity.
Industry:Semiconductors
The propagation of small cracks in the glassivation layer of a semiconductor device.
Industry:Semiconductors
