- Industry: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
The anticipated lifetime of a device, how long it can be expected to "survive" in the user's system. This is normally defined as a failure rate (percent per 1000 hours) or as an MTBF (Mean Time Between Failures, expressed in hours).
Industry:Semiconductors
A device or devices randomly chosen from a lot of material. Sampling assumes that randomly selected devices will exhibit characteristics during testing that are typical of the lot as a whole.
Industry:Semiconductors
The process whereby the lid is fastened onto a cavity (or hermetic) type semiconductor device. Sealing methods include solder (whereby a metal lid is soldered to a metal seal ring), weld (where a metal lid is welded to a metal package base), and glass (or ceramic) seal (where a ceramic lid is fastened to a ceramic base with reflowed glass).
Industry:Semiconductors
An element, such as silicon or germanium, that is the intermediate in electrical conductivity between the conductors and the insulators.
Industry:Semiconductors
Application of a unique alphanumeric identifier to each unit of a lot of devices to afford traceability to variables data, individual radiographs, etc.
Industry:Semiconductors
In digital data systems, a system which utilizes a single large processor, normally in multiprocessing or multiprogramming modes, to perform all required system computations.
Industry:Semiconductors
A region of surface conduction opposite in type from that expected from the bulk doping. Channels are sometimes introduced unintentionally by surface ionic contamination. The type of channel (P or N) will be determined by the type of majority carrier introduced into the channel.
Industry:Semiconductors
Electrical testing performed for the purpose of determining typical device performance characteristics and/or parametric limits.
Industry:Semiconductors
The measurement (in /°C or ppm/°C) of the rate at which a given material will expand or contract as the temperature changes. Where two materials with different rates of thermal expansion are joined, expansion or contraction will strain the bond interface between them. Continual straining of that bond could result in separation.
Industry:Semiconductors
