- Industry: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
A method of producing thin films by freeing molecules from a solid source through ionic bombardment in order to deposit them on a nearby surface.
Industry:Semiconductors
The functional design of a complex component, circuit or system, including both its hardware and its compatibility with external hardware and software.
Industry:Semiconductors
Gross quantitative data indicating the total number of devices subjected to and passing or failing the various screening steps in a test sequence.
Industry:Semiconductors
A detailed definition of a device's electrical and mechanical configuration, assembly, processing and testing used as a base from which to track subsequent changes.
Industry:Semiconductors
Normally stated in terms of °C/W, it is the indicator of the package's ability to dissipate the heat generated by the chip during operation. ?JC is the indicator of the chip's ability to pass the heat generated by the semiconductor junctions to the package, that is the thermal resistance between the semiconductor junction and the case; ?JA is the thermal resistance between the semiconductor junction and the ambient environment, or the indicator of the case's ability to pass chip heat into the ambient air.
Industry:Semiconductors
A corrosion that results from the interaction of gold with aluminum that contains more than 2% silicon. At temperatures greater than 167°C, the silicon will act as a catalyst to create an aluminum-gold alloy. The resulting metallic migration results in gaps (called Kirkendall voids) in the gold-aluminum interface. Bimetallic contamination can decrease bond wire adhesion and can lower current carrying capability at the interface. In extreme cases, bond wires will actually lift from the pad. Bimetallic contamination is frequently referred to a§ "purple plague."
Industry:Semiconductors
Logic using two logic states (ON and OFF, or Logic "0" and Logic "V).
Industry:Semiconductors
Similar to Temperature Cycle except that the environments are liquid, and the transfer is immediate. Normally Performed for 15 cycles from 0°C to + 100°C, this is a much more severe stress of the package seal and is normally employed only on a sample basis.
Industry:Semiconductors
Devices or processes in which current-carrying areas and substrates are of different polarities (such as the PNP and NPN transistors used to form TTL circuits). Both holes and electrons are transported in bipolar devices. Some technologies, such as BI-FETTM, combine bipolar and unipolar elements.
Industry:Semiconductors
Devices or processes in which current carrying areas and substrates are of similar polarities, usually MOS devices.
Industry:Semiconductors
