Test equipment

Test equipment

Industry: Semiconductors

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Test equipment

flip chip attach (FCA)

Semiconductors; Test equipment

The technique of attachment of an IC chip to a substrate using solderable bumps between the silicon chip and substrate.

federal communications commission ratings (FCC ratings)

Semiconductors; Test equipment

Among other duties, the FCC is responsible for rating personal computers and other equipment as either Class A or Class B. The ratings indicate how much radiation a personal computer emits. Almost ...

fault detection (FD)

Semiconductors; Test equipment

Presence of a fault is detected by observation of one or more discrepancies. Because of the complex relationship between faults and discrepancies, more than one fault may be suspected when a ...

isolation and remediation metrics fault detection (FDIR)

Semiconductors; Test equipment

Metrics that quantify the likelihood that a fault will be detected, isolated and remediated.

frequency division multiplex (FDM)

Semiconductors; Test equipment

Transmission of two or more signals over a common path by using a different frequency band for each signal.

frequency division multiple access (FDMA)

Semiconductors; Test equipment

A digital radio technology that divides the available spectrum into separate radio channels. Generally used in conjunction with Time Division Multiple Access (TDMA) or Code Division Multiple Access ...